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Lapmaster International - Accupol Lapping & Polishing Wafer Thinning Jig

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The Lapmaster line of Accupol Lapping & Polishing Wafer Thinning Jig Fixtures are designed to control precision thickness and parallelism of thin, fragile components made of semiconductor, compound semiconductor and electro-optics materials. A vacuum chuck retains the wafers during processing. Single or multiple wafers can be retained and processed within a fixture. An excellent planarizing tool for wafer processing in small quantity lots. Three (3) sizes are available, with the largest unit capable of processing a 6" (150mm) diameter wafer.

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