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CeramTec North America - Oxide Ceramics

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RUBALIT® - superior substrate materials
from a global leader

A key prerequisite for CeramTec's successful partnership with the electronics industry is the ability to deliver the right materials. The family of RUBALIT® materials developed by our company has become a byword of quality among the world's most renowned manufacturers of hybrid circuits and has established itself as the standard choice in many electronic circuit applications.

High strength and thermal conductivity are the characterizing features of these substrate materials. Providing an outstanding surface quality on both faces, RUBALIT® 708S (96% Al203) gives outstanding results with commercially available thick-film pastes and metallization systems. In addition, this material is suitable for both fine line and sometimes thin-film applications. For optimum results in thin-film technology, RUBALIT® 710 (99.6% Al203) is the material of choice.

High-Performance Materials for Electronic Applications:
ALUNIT® Aluminum Nitride Ceramics

Cool solutions for power electronics
Progressive advances in power electronics have called for the use of sophisticated cooling systems to dissipate the intense heat build-up. For example, special heat exchangers based on our ALUNIT® material allow the use of water as a cooling fluid as a substitute for environmentally hazardous oil cooling systems. Used as mountings for electronic power components, these heat exchangers dissipate heat at its point of origin.

ALUNIT® for maximum performance
With its extremely high thermal conductivity of 180 W/mK and outstanding electrical insulation properties, ALUNIT® is the high-end supplement to our RUBALIT® range. The thermal expansion coefficient of this material is comparable to silicon. Its electrical and mechanical characteristics are similar to aluminum oxide. Like RUBALIT® , ALUNIT® is non-toxic and environmentally compatible, presenting no disposal problems.

These new properties open entirely new fields of application in advanced circuit engineering. With its enhanced heat dissipation, ALUNIT® enables the production of compact high-performance solutions. It is the preferred substrate for power hybrid and VLSI-type MCM circuits. Our product range includes substrates and dry-pressed components made to customer's specifications ready for further processing, and also products already subjected to finishing operations such as lasering, grinding, and polishing.

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