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Intermark (USA), Inc. - THERMAL & EMI DUAL FUNCTIONAL SHEET - EMPV, EMPV2

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EMPV and EMPV2 series serves thermal and EMI dual fucntion with silicon free feature. This silicon-free material eliminates concerns over contact failure due to siloxane gas. Also this conforms to a great variety of secondary processing such as enhancement in performance by compounding magnetic foils.

EMPV

  • Thickness - 0.5, 1.0, 2.0 mm
  • Thermal Conductivity - 1.1 W/m・K
  • Hardness - 55 (ASKER C)
  • Volume Resistivity - 1x1013 Ω・cm
  • Magnetic Permeability - 6 (at 10 MHz)
  • Color - Liver
  • Flame Retardant UL94V1
  • Material - Soft Ferrite + Silicone

EMPV2

  • Thickness - 0.5, 1.0, 2.0 mm
  • Thermal Conductivity - 1.8 W/m・K
  • Hardness - 60 (ASKER C)
  • Volume Resistivity - 5x1013 Ω・cm
  • Magnetic Permeability - 7 (at 10 MHz)
  • Color - Liver
  • Flame Retardant - Equivalent to V0 (t=2mm)
  • Material - Acrylic thermal conductive layer for electromagnetic
    wave absorption

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