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NX PCB.xchange allows for associative and bi-directional data exchange from 2D ECAD systems to 3D MCAD within NX. The 3D board or flexible printed circuit assembly geometry is created automatically and can then be used in the context of larger systems for tolerance and packaging analysis as well as downstream thermo-fluid cooling analysis using the powerful combination of NX Flow and NX Thermal.

NX thermo-fluid and thermo-elastic interactions. The NX Thermal heat transfer modeling capabilities can be explicitly combined with the NX Flow computational fluid dynamics (CFD) solution (also available within the NX Advanced Simulation environment). This combination allows a user to simulate strong and fully-coupled thermo-fluid interactions problems, including integration of radiative heat transfer and fluid flow. When NX Flow and NX Thermal are purchased together, the thermo-fluid explicit solver is automatically turned on within NX at no additional cost, offering both conduction and radiation modeling to be fully coupled with 3D fluid flow. Furthermore, NX Thermal temperature results can be mapped to a separate NX Nastran FE model for thermo-elastic analysis.

By virtue of being part of the NX environment, NX Thermal provides the ability to model, catalog and share parts and material libraries among the NX design team, thereby minimizing tedious rework and potentially costly modeling errors.