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HyRelex, a high performance flexible circuit material, is constructed with reinforced high temperature polymer chemistry. These thin, flexible interconnect materials provide excellent thermal, mechanical, electrical and moisture resistance properties.

The low dissipation factor, thermal stability and smooth surface profile minimize phase shift with frequency and temperature, and yields exceptional low loss circuit performance. HyRelex is ideally suited for high frequency and high temperature applications and retains its excellent electrical and mechanical properties in harsh environments. HyRelex performs in a variety of applications including avionics, military, automotive, double sided, multilayer and rigid flex circuits, telecommunications, medical and consumer electronics.

At a dielectric constant of 2.6, HyRelex laminates are available in 1.7 mil and 3mil thickness; at 2.9 Dk, the available thicknesses are 2.3 mil and 3.5 mil.

In addition to low loss, low Dk and low moisture absorption, HyRelex offers excellent peel strength for high temperature assembly and power handling requirements. HyRelex exhibits exceptional dimensional stability, yielding fine feature registration.