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About Hot Melt Adhesives
Hot melt adhesives are solvent-free chemical compounds that are used to join materials. They can be repeatedly softened by heat and hardened or set by cooling, allowing parts to be removed or repositioned during assembly. Most hot melt adhesives solidify at temperatures below 180° F and become low viscosity fluids at temperatures above 180° F. They form strong bonds, set rapidly upon cooling, and are relatively easy to handle. In general, hot melt adhesives are more resistant to water, moisture, and humidity than thermoplastic polymers. Some products contain acetals, acrylics, elastomers, natural or synthetic rubbers, epoxy resins, water-based resins, wax-based binders, styrene compounds, or vinyl systems. Others contain bituminous substances, ethylene copolymers, styrene copolymers, glues and gums, polyamides, thermoplastic polyesters, vinyl esters, or polyethylene (PE). Commonly used chemical systems also include polypropylene (PP), polysulphone, polyurethane (PUR), polyetherimide, and polyolefin. Filled or reinforced compounds consist of resins with additional modifiers such as fillers, pigments, or chopped fibers.
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