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Type / Form
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Your choices are...
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Adhesive
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Organic or inorganic chemical compounds for joining components. They require clean surfaces compatible with the adhesive.
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Casting Resin / Two-part (A+B)
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Casting resins are plastic or elastomer compounds used to cast parts, molds or form a structure in place. Casting resins usually consist of two part (A+B) systems that are cast into open molds or forms. A multi-component system typically consists of two separate components (A + B) where A is the resin and B is the catalyst or hardener. The user or fabricator mixes the components to start the curing process. Two or multi-component adhesive or sealant systems consist of two or more resins or a resin and a hardener, crosslinker, activator or catalyst that when combined react and cure into a polyermized compound or bond. Two component systems are mixed and then applied.
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Coating / Paint
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Enclosure (Electrical / Electronic)
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Encapsulant / Conformal Coating
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Encapsulants are compounds used for the sealing or covering of an element or circuit for the purpose of mechanical and environmental protection. Typically the encapsulant layers are not more 100 mils thick.
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Gasket / Gasketing
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Magnetic Shielding
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Molding Compound
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Plastics or elastomers suited for fabricating parts by injection molding, compression molding, blow molding or film extrusion, reaction injection molding (RIM), resin transfer molding (RTM) or molded stock shapes.
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Sealant / Gap Filling Compound
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Gap filling or underfill compound have the ability to fill in a gap or space between two surfaces to be bonded or sealed. Flexible sheet materials as well as sealants or Form-In-Place compounds (FIP, liquid and viscous materials) used to fill gaps between seams, or on surfaces, to contain fluids, prevent leaks, and prevent infiltration of unwanted material.
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Stock Shape / Custom Part
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Stock shapes of plastics or elastomers suited for fabricating parts by machining, assembly or other processes.
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Tape / Film
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Mastics are highly viscous adhesives applied by trowel to give thick glue lines with gap sealing properties. Mastics are used to bond tiles to sub-flooring. Mastics fill in gaps or irregularities in a surface before tile or other materials are applied.
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Thermal Compound / Interface
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Material designed to form a thermally conductive layer on the substrate, between components or within a finished product. Thermally conductive resins, thermoplastics, adhesives and greases are often used between an electrical device and a heat sink to improve heat dissipation.
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Specialty / Other
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Other specialty, proprietary or unlisted organic or inorganic technology or cure type for adhesive or sealant related applications
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Electrically Conductive?
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Resin or compound having a high degree of electrical conductivity (low resistivity) for applications such as Anti-static or ESD control, EMI / RFI shielding, thick film metallization and device & board electrical interconnection.
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Search Logic:
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"Required" and "Must Not Have" criteria limit returned
matches as specified. Products with optional attributes
will be returned for either choice.
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Anti-static / ESD Control?
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Material designed with relatively high electrically conductivity or low electrical resistivity for electronic, anti-static or electrostatic discharge (ESD) applications.
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Search Logic:
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"Required" and "Must Not Have" criteria limit returned
matches as specified. Products with optional attributes
will be returned for either choice.
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Electrical Insulating / Dielectric?
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Dielectric resin, plastics, compounds and encapsulants are electrical insulating. Dielectric compounds are used to form a barrier or isolator between electrical or electronic components.
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Search Logic:
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"Required" and "Must Not Have" criteria limit returned
matches as specified. Products with optional attributes
will be returned for either choice.
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