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Coating Process:
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Your choices are...
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Centrifugal / Dip-Spin
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Coating equipment or systems where the entire part is dipped into a tank filled with the paint or coating media and then excess coating is removed by spinning the part. Bulk painting of small and unchangeable parts is accomplished by dipping a mesh basket of parts, followed by rapid rotation of the basket to remove excess paint. Parts from the dip-spin coater are dumped onto a conveyor belt for curing.
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Chemical Vapor Deposition (CVD)
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In chemical vapor deposition (CVD) processes, a precursor gas or mixture of gases is fed into a chamber and reacted with an energy source (usually heat) to form thin film coatings. CVD processes are useful in the deposition of dielectric films such as oxides and nitrides. The energy or heat source may be a plasma, substrate induction, or resistance heater.
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Curtain / Flow Coating
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In curtain coaters, flow coaters, trickle coaters or cascaders, paint or liquid coating media is poured forming a waterfall, narrow stream or sheet through which parts or stock materials are passed. Precise, narrow streams are used to selectively apply coating, primers or adhesives only portion of a part's surface.
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Dip / Immersion
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Coating equipment or systems where the entire part is dipped into a tank filled with the paint or coating media and then excess coating drip off the part falling back into the tank.
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Electrocoat / Electrophoretic
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E-coat, electrocoat or electrophoretic coating use the charging of particles to attract paint or coating particles or molecules in an immersion bath to the surface of a submerged part. E-coating is a dip coating process where the coating or paint solids suspended in the bath are given an electrical charge, which is then attracted to the part. In a method closely paralleling electroplating, paint is deposited using direct electrical current. The electrochemical reactions that occur cause water-soluble resins to become insolubilized onto parts that are electrodes in the E-coating paint tank. Subsequent resin curing is required. E-coat processes are also referred to as electrocoating, electrodeposition, electronic coating, e-painting, electronic painting, electro coating, electrophoretic coat and electrophoresis coating.
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Electrostatic Spray
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In electrostatic coating, paint droplets or coating powder particles are charged and then sprayed toward a part with an opposite and attractive electric charge. The spray process may be airless or air assisted.
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Fluidized Bed
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In fluidized bed systems, air is blown up through a porous bed or screen to suspend coating particles thereby forming a fluidized bed. Hot parts are inserted into the fluidized bed allowing the powder coating particles to stick onto the exposed surfaces.
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Impregnation
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Impregnation equipment uses vacuum, pressure and/or wicking action techniques to drive resins or coating materials into parts. In trickle impregnation systems, surface tension effects allow resins to be wicked or soaked up by the internal porosity of a part (like a sponge soaking up water). In vacuum-pressure impregnation equipment uses vacuum and/or pressure to drive resins or coatings into a surface after a dip or trickle coating. Impregnation equipment is designed for sealing, filling or impregnating the porous surfaces of metal castings, stator windings, transformers or open porosity powder metal parts. Impregnation of P/M parts improves integrity and corrosion resistance. Impregnation of electrical or electronic components can provide electrical insulation as well as environmental protection.
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Liquid Phase / Electrochemical Deposition (ECD)
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Thin film processes use a liquid phase such as electrochemical deposition, liquid phase epitaxy, electroless plating and electroplating and electrophoretic deposition.
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Physical Vapor Deposition (PVD)
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Physical vapor deposition processes form thin film layers through evaporation or sputtering (glow discharge processes) of atoms from a source and then condensing or depositing the material onto the surface, substrate, wafer or part.
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Powder Coating
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In powder coating systems, protective or decorative coatings are formed by application of powder to a substrate, after which the powder is fused into a continuous film by the application of heat or radiant energy. Powder coatings are finely divided particles of generally containing organic polymer or binder, pigments, fillers, and additives. In a fluidized bed powder coating process, hot parts are introduced and the powder coating particle stick or fuse onto the part's surface. In electrostatic powder coating systems, the particles are given an electric charge that causes the particles to be attracted to an oppositely charged part.
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Spin Coater
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In spin coating, a thin coating of resin, often a photoresist, is poured onto the surface of the spinning part, typically a silicon wafer or substrate. The spinning coating process provides a very thin layer or controlled thickness across the surface, which is important for photolithography type applications.
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Spray / Atomization (Wet)
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A coating process using wet spray paint or fluid coating media where a spray gun directs a coating or paint aerosol toward the part's surface. The paint or coating aerosol is formed using a rotary (spinning disc or bell) atomizer, an ultrasonic atomizer or by forcing the media through a nozzle with pressure.
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Specialty / Other
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Other unlisted, specialized, or proprietary coating process or technology.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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PVD Processes
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Your choices are...
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Evaporation - Electron Beam
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A PVD process using an electron beam to vaporize the material to be deposited on the substrate.
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Evaporation - Induction
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A PVD process using induction heating to vaporize the material to be deposited on the substrate. Material in a crucible surrounded by an induction heating coils is heated by inducing a current in the material.
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Evaporation - Laser / Plasma
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A PVD process using a laser beam or plasma source to vaporize the material to be deposited on the substrate. Evaporation by a laser source is sometimes called Physical Laser Ablation (PLD). Evaporation by a plasma source is referred to as Ion Plating.
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Evaporation - MBE / Epitaxial
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Molecular beam epitaxy uses the evaporation of sources under ultra-high vacuum (UHV) conditions to form epitaxial deposit.
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Evaporation - Resistance
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A PVD process using resistance heating to vaporize the material to be deposited on the substrate. Passing current through the tungsten filament or element heats material on a tungsten filament or in a crucible surrounded by the resistance-heating element.
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Sputtering - DC
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A PVD process using plasma (glow-discharge) to ionize or knock (sputter) atoms off a target (source material) and deposit the positively charged ions on a substrate or wafer. The DC power source results in metal target with a negative bias and a substrate with a positive bias causing unidirectional plasma current from the wafer to the target.
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Sputtering - DC Pulsed
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Pulsed sputtering is a DC sputtering process where the power source is pulsed.
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Sputtering - Magnetron
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In DC or RF Magnetron sputtering, powerful magnets placed behind the target and sometimes around the plasma field provide several enhancements to the sputtering process such as trapping electrons that would cause ancillary heating of the chamber, forming a stable plasma discharge at lower pressures, directing additional ions at the substrate and confining the plasma away from the wafer or substrate.
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Sputtering - Ion Beam
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Ion beam sputtering utilizes an ion beam to liberate and ionize atoms from the target material, which are then deposited on the substrate. The beam, target material and substrate are not electrically coupled as in the conventional DC and RF sputtering processes.
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Sputtering - RF
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A PVD process using plasma (glow-discharge) to ionize or knock (sputter) atoms off a target (source material) and deposit the positively charged ions on a substrate or wafer. The high frequency, alternating current (AC) or radio frequency (RF) power source can provide a forward (positive) or reverse (negative) bias. In DC sputtering, only positive sputtering occurs. The negative sputtering or is useful for sputtering cleaning or ion milling of the substrate prior to deposition.
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IBAD (Ion Beam)
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Ion beam assisted deposition (IBAD) is a PVD deposition that uses an ion beam directed at vaporized atoms or ions to deposit material. The beam, source material and substrate are not electrically coupled as in the sputtering process. Ions (Ar, N, O) are produced in a separate chamber and then directed at atoms of the coating material are liberated by evaporation, sputtering, or another process. The ion beam ionizes or boosts the energy level of some of the coating atoms, which are then deposited on the substrate.
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Other
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Other unlisted, specialized, or proprietary PVD processes.
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Search Logic:
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Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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CVD Processes
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Your choices are...
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APCVD (Atmospheric Pressure)
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Chemical vapor deposition process running under atmospheric pressures.
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LPCVD (Low Pressure)
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Chemical vapor deposition process running under low or sub-atmospheric pressures.
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MOCVD (Metal Organic)
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Metal organic chemical vapor deposition process has the capability to deposit epitaxial films.
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PECVD (Plasma Enhanced)
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Chemical vapor deposition process where reactions are enhance through the development of a plasma energy source.
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PHCVD (Photon / Laser Enhanced)
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Chemical vapor deposition process where reactions are enhance through the photon or laser energy source.
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Other
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Other unlisted, specialized, or proprietary CVD processes.
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Search Logic:
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Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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