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Compound Type
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Your choices are...
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Adhesive
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Adhesives are organic or inorganic chemical compounds for joining components. They require clean surfaces compatible with the adhesive.
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Binder / Base Polymer
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Base polymers or binders, binding agents and film formers are starting components mixed with other fillers and additives by compounders to produce plastic resins, elastomers, adhesives, sealants, coatings, paints or other polymer based products.
Binders are also adhesives used to hold together particulates such as polyvinyl alcohol, waxes, phenolics or other compounds. They are used in fabricating powder metal compacts, ceramic binders, fuel pellets, brake pads, particle board, and pharmaceuticals pills or preparations.
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Casting Resin
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Casting resins are plastic or elastomer compounds used to cast parts, molds or form a structure in place. Casting resins usually consist of a two-part (A+B) system that is placed into open molds or forms, where A is the resin and B is the catalyst or hardener. The fabricator mixes the components to initiate the curing process.
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Caulk / Grout
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Caulks, grouts and joint compounds have a sufficiently low viscosity to allow pumping of the material into joints or cracks, to seal or repair. Caulk typically consists of a flexible material, while grouts are typically based on thin-set inorganic mortars. Polymer or resin binder based grouts are available.
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Encapsulating / Potting
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Encapsulants and potting compounds are resins used to encapsulate circuit boards or semiconductor devices, fill a container of electronic devices or infiltrate electrical coils to provide environmental protection and electrical insulation. Ceramic cement based potting compounds are available for high temperature applications.
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Leveling / Filling Compound
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Leveling compounds, gap fillers, chocking materials and mastics are highly viscous materials applied by trowel to give thick glue lines usually with gap sealing properties. Chocks, chocking and floor leveling compounds are during the installation of heavy equipment or machine bases. Chocking or leveling compounds allow machines to be installed level or plumb and can be used in place of metal or plastic shims or shimstock. Mastics fill in gaps or irregularities in a surface before tile or other materials are applied. They are also used to bond tiles to sub-flooring. Repair compounds or gap fillers are used to fill in gaps or repair cavities or holes in a part, casting or structure. Typically, these compounds may also be used as adhesives or sealants or have sealing or bonding characteristics.
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Sealant
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Sealants are liquid compounds used to fill gaps between seams, threads or on surfaces, to contain fluids, prevent leaks, and prevent infiltration of unwanted material. Higher viscosity sealants are used when larger gaps need to be filled.
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Thermal Compound / Heat Conductive
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Material designed to form a thermally conductive layer on the substrate, between components or within a finished electronic product. Thermally conductive resins, thermoplastics, encapsulants, potting compounds, tapes, pads, adhesives and greases are often used between a heat-generating electrical device and a heat sink to improve heat dissipation.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Your choices are...
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Ceramic / Glass
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Ceramics consist of oxides, carbides, nitrides, carbons and other non-metals with high melting points. Ceramics are suitable for applications requiring wear resistance, refractoriness, low electrical resistivity or other specialized characteristics.
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Concrete / Masonry
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Concrete and cements consist of a mixture of a binder or clinker and a coarser aggregate. They are used to patch or line floors and walls, bond brick, and join components for use in high temperature applications. Clinker is a fused mineral or mineral mixture, such as alumina or bauxite and lime, which is crushed into a fine powder to manufacture cements. Aggregates are coarser, granular materials that are added to mortar, grout or cement at mixing time to impart special properties such as refractoriness, erosion resistance, and oxidation resistance. Synthetic aggregates are fused mineral or mineral mixtures crushed to a coarse, granular size range rather than a fine, powdered clinker. Portland cement is the most common bond used in structural concretes and mortars. Polymer cements have a resin bond and are used in corrosion protection, mortars for corrosion-resistant floor tiles, and other specialized industrial applications. Masonry consists of tile, bricks, stone or other ceramic components bonded together with mortar or adhesive.
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Composites
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Composite materials typically consist of a matrix and a dispersed, fibrous, or continuous second phase. The second phase may reinforce (strengthen or stiffen), alter electrical or magnetic properties, or enhance wear or erosion resistance.
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Metal
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Metals are opaque, fusible, ductile, and typically lustrous substances that are good conductors of heat and electricity. They form cations by the loss of electrons and yield basic oxides and hydroxides. Metals that are used in structural engineering applications have a high toughness that is a combination of high strength and ductility.
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Paper / Paperboard
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Paper or paperboard products are produced from a pulp of cellulose, cotton, wood or other vegetable fibers. The pulp is laid down on a fine screen from a water suspension to form sheets that are dried and further processed.
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Plastic
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Plastics are organic, synthetic or processed materials that are mostly thermoplastic or thermosetting polymers of high molecular weight. They can be made into objects, films, or filaments.
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Porous Surfaces
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Substances are adhesives or sealants with a high viscosity or gel-like consistency. Typically, these materials have the ability to work with porous surfaces.
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Rubber / Elastomer
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Rubber and elastomers are characterized by a high degree of flexibility and elasticity (high reversible elongation). Natural or synthetic rubber is vulcanized to increase useful properties such as toughness and resistance to wear for use in tires, electrical insulation, and waterproof materials. Vulcanization is a chemical treatment that adds sulfur and heat to crosslink the rubber. Natural rubber is an elastic substance that is obtained by coagulating the milky juice of any of various tropical plants. Essentially, natural rubber is a polymer of isoprene, and is prepared as sheets and then dried. Synthetic rubbers or elastomers can be based on a variety of systems such as silicone, polyurethane or neoprene.
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Textiles / Fabrics
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Substances are adhesives or sealants suitable for coating, filling, sizing or sealing non-woven or woven textiles. Sizing adhesives or resins are used to fill in paper, textile webs, and other fibrous products.
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Wood / Wood Product
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Wood is a natural composite extracted from the stems, branches, and roots of trees. Wood is a hard fibrous substance that consists of xylem, cellulose fibers in an amorphous, lignin polymer matrix. Lignin is a biogenetic crosslinked polymer which bonds together adjacent cell walls into the straw or wood tissue composite. Cellulose is a polysaccharide (C6H10O5)x of glucose units that constitutes the chief part of the cell walls of plants. It occurs naturally in fibrous products such as cotton and kapok, and is the raw material of many manufactured goods as paper, rayon, and cellophane.
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Other
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Other unlisted, specialty, or proprietary substrates.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Dissimilar Substrates?
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Adhesive or sealant systems can bond dissimilar substrates such as metal to rubber.
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Search Logic:
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"Required" and "Must Not Have" criteria limit returned
matches as specified. Products with optional attributes
will be returned for either choice.
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Cure Type / Technology
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Your choices are...
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Two Component System
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Two or multi-component adhesive or sealant systems consist of two or more resins or a resin and a hardener, crosslinker, activator or catalyst that when combined react and cure into a polyermized compound or bond. Two component systems are mixed and then applied.
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Single Component System
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Single component adhesives or sealant systems consist of one resin that hardens by reaction with surface moisture, a surface applied activator-primer, or through the application of heat.
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Thermosetting (Crosslinking/ Vulcanizing)
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Thermoset plastics and thermoset resins are crosslinked polymeric resins cured using heat or heat and pressure. Cured thermoset resins generally have higher resistance to heat when compared to thermoplastics, but they cannot be melted down and reprocessed.
Thermoset adhesives are crosslinked polymeric resins cured using heat or heat and pressure. Cured thermoset resins do not melt and flow when heated, but they may soften. Phenolic, melamine and urea formaldehyde resins are thermosetting adhesives that offer strong bonds and good resistance to high temperatures. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent, resulting in greatly increased strength, stability and elasticity in rubber-like materials. RTV silicone rubbers are room temperature vulcanizing materials. The vulcanizing agent is a crosslinking compound or catalyst. Sulfur is the traditional vulcanizing agent used with natural rubber. Silicones use moisture, acetic acid and other compounds as curing agents.
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RTV / Room Temperature Curing
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Polymer resin or compounds that either cure or vulcanize at room temperature. Vulcanization is a thermosetting reaction involving the use of heat and/or pressure in conjunction with a vulcanizing agent, resulting in greatly increased strength, stability and elasticity in rubber-like materials. The vulcanizing agent is a crosslinking compound or catalyst. Silicones use moisture, acetic acid and other compounds as curing or vulcanizing agents.
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Contact / Pressure Sensitive (PSA)
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Pressure sensitive adhesives adhere to most surfaces with very slight pressure and they retain their tackiness. They are available in solvent and latex or water based forms. Pressure sensitive adhesives are often based on non-crosslinked rubber adhesives, acrylics or polyurethanes. They form viscoelastic bonds that are aggressively and permanently tacky, and adhere without the need of more than finger or hand pressure.
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Reactive / Moisture Cured
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Reactive resins are single component adhesives that are applied in the same way as hot melt adhesives. The resins react with moisture to crosslink and polymerize resulting in a cured material. Polyurethane reactives (PUR) are examples of this type of technology. Certain silicones and cyanoacrylates also use a reaction with moisture or water to cure the adhesive or sealant.
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Thermoplastic / Hot Melt
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Thermoplastics can be repeatably softened by heat and then hardened, or set by cooling, which allows parts to be injection molded or thermoformed and scrap to be reprocessed.
Thermoplastic or hot melt adhesives can be repeatably softened by heat and then hardened, or set by cooling, which allows parts to be removed or repositioned during assembly. Hot melt adhesives are typically solvent-free thermoplastics that melt or drop in viscosity above 180°F, and then rapidly set upon cooling. They are used in a variety of manufacturing processes, including bookbinding, woodworking, construction, product assembly, and box and carton heat sealing. Hot melt adhesive technology stemmed from the previous use of molten wax for bonding.
Thermoplastic systems were introduced to satisfy performance needs. Typically, a pure hot melt system will not have the heat resistance of two-part, catalyst or thermoset adhesives. Hybrid hot melt systems are available that have exhibit a degree of reactive curing. Polyethylenes, polyamides and ethylene-vinyl acetates are common types of hot melt adhesives. Heat activated adhesives become sticky or tacky when warmed, and are used in contact or PSA type applications.
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UV / Radiation Cured (also EB, Light)
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UV or radiation cured adhesives use ultraviolet light, visible light or electron bean irradiation to initiate curing, which allows a permanent bond without heating or excessive heat generation. One disadvantage of UV curing adhesives is the requirement that one substrate is UV transparent. Some UV resin systems employ a secondary curing mechanism to complete curing of adhesive regions shielded from the UV light. EB curable adhesives use electron beam radiation to cure or initiate curing. The electron beam can penetrate through material that is opaque to UV light.
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Specialty / Other
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Other unlisted, specialty, proprietary technology or cure type.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Features
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Your choices are...
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Anti-static / ESD Control
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Material designed with relatively high electrically conductivity or low electrical resistivity for electronic, anti-static or electrostatic discharge (ESD) applications.
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Electrically Conductive
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Resins or compounds with a high degree of electrical conductivity (low resistivity) for applications such as anti-static or ESD control, EMI / RFI shielding, thick film metallization and device and board electrical interconnection.
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Electrical Insulation / Dielectric Material
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Dielectric compounds and electrical insulation materials are used to form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components will influence material selection based on the dielectric strength in order to reduce shorting. Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths.
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EMI / RFI Shielding Material
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Polymers or elastomers designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). Typically, these compounds have a high degree of electrical conductivity.
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Filled / Reinforced
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Filled or reinforced compounds consist of resins with additional modifiers such as fillers, pigments, or chopped fiber reinforcements. Filled compounds are typically ready to use.
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Flame Retardant / UL 94V-0 Rated
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Products are flame retardant in accordance to Underwriters Laboratories, Inc. (UL) Flame Class 94V-0 or other equivalent ISO standards. These materials reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to the substrate.
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Flexible / Dampening
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Products are designed to provide flexibility or dampening of sound, vibration or shock in suitable applications. Flexible adhesives or sealants form a layer that can bend or flex without cracking or delaminating.
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Laminating / Composites
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Products are designed for constructing laminating strip structures or SCRIMP matrix resins for composite construction. SCRIMP is an acronym for Seemann composites resin infusion molding process.
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Non-corrosive Cure
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Silicone or reactive systems use a non-corrosive cure system such as a metal or oxime catalyst.
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Phase Change
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Thermal interface materials use a phase change to enhance thermal characteristics or heat absorption from electronic devices or electrical components.
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Solvent Based (Volatile Organic)
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Solvent-based adhesive resins use a volatile organic solvent (VOC) to thin or alter viscosity. Typically, solvent-based adhesive resins result in greater environmental or regulatory control problems. Solvents can also present a fire hazard or risk explosion, depending on the plant or job site.
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Thermal / Heat Insulating
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Thermally insulating resins, plastics, compounds and encapsulants provide a thermal barrier between components and a hot or cold source.
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UL Approved
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Products are approved to or recognized under the requirements of Underwriters Laboratories, Inc. (UL).
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Water Based / Latex Dispersion
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Water-based or water borne adhesive resins are water soluble or water emulsion-based resin systems that typically do not contain any VOC solvents. Water-based adhesive resins usually present fewer environmental or regulatory control problems.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Industry
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Your choices are...
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Aerospace
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Products are designed for aerospace applications. For example, they can be used to bond composite structures to other composite or metallic frame components.
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Automotive
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Products are designed for automotive applications. For example, they can be used to bond panels and seal windows.
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Electronics
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Products are designed for electronics applications. For example, they can be used in potting or encapsulating compounds, conductive adhesives, and dielectric sealants.
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Electrical Power / HV
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Products are resins, compounds and plastic composites suitable for electrical power or high voltage applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation.
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Marine
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Products are designed for marine applications. They can be immersed in water and withstand exposure to marine atmospheres.
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Medical / Food (Sanitary / FDA)
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Products are suitable for medical or food-contact applications. They typically comply with requirements from regulatory agencies such as the Food and Drug Administration (FDA), U.S. Department of Agriculture (USDA), National Science Foundation (NSF), 3A-Dairy, Canada AG, or USP Class VI.
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Military / Government (MIL-SPEC / GG)
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Products adhere to U.S. military specifications (MIL-SPEC).
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OEM / Industrial
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Products are designed for use by original equipment manufacturers (OEMs) for the assembly, sealing or fabrication of products.
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Optical Grade / Material
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Polymers or elastomers designed for optical or photonics applications such as transparent polycarbonate or acrylic lens materials.
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Photonics / Optoelectronics
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Products are designed for optoelectronics or photonics applications such as cements for bonding simple lenses into compound structures.
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Semiconductors / IC Packaging
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Products are designed or suitable for semiconductor or semiconductor packaging applications.
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Repair (MRO) / Construction
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Products are designed for use by construction contractors and in maintenance, repair and operation (MRO) applications. Adhesives or sealants can be designed for general-purpose construction or architectural applications. Construction materials include wood, wood products, glass, cement products (mortar, concrete, masonry), plaster board, metal trim, flooring tile, sub-floor or underlayment, plaster board, sheet metal roofing or flash, metal ties, insulation materials (fiberglass, foam) and bitumen-based roofing materials.
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Tooling / Mold Material
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Products are designed for tooling or mold fabrication such as polyurethane shapes or castable silicones.
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Other
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Other unlisted industry.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Gap Fill
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Gap fill is the spacing or gap between the substrate that the adhesive or sealant can accommodate.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Viscosity
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Viscosity is a measurement of a fluid's resistance to flow. Water is lower in viscosity than motor oil or honey. Oil is lower in viscosity than tar or molasses. Depending on the application method, viscosity determines how well a resin fills the cavities or voids in a mold.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Use Temperature
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Use temperature is the range of temperatures to which products can be exposed without the degradation of structural or other required end-use properties.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Thermal Conductivity
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Thermal conductivity is the linear heat transfer per unit area through a material for a given applied temperature gradient. Heat flux (h) = [thermal conductivity (k) ] x [temperature gradient ( T)]
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Coeff. of Thermal Expansion (CTE)
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Coefficient of linear expansion (CFE) is the amount of linear expansion or shrinkage that occurs in a material with a change in temperature.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Tensile Strength (Break)
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Tensile strength at break is the maximum amount of stress required to fail or break the material under tension loading test conditions. Tensile tests are typically performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets) as well as other OEM proprietary standards.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Elongation
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Elongation is the percent amount of deformation occurring during a tensile test or other mechanical test.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Electrical Resistivity
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Resistivity is the longitudinal electrical resistance (ohm-cm) of a uniform rod of unit length and unit cross-sectional area. Resistivity is the inverse of conductivity.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Dielectric Strength
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Dielectric strength is the maximum voltage field that the material can withstand before electrical breakdown occurs.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Dielectric Constant (Relative Permittivity)
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The dielectric constant is the relative permittivity of a material compared to a vacuum or free space. k =  r = / o= where is the absolute permittivity of the material and o is the absolute permittivity of a vacuum 8.85 x 10-12 F/m.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Index of Refraction
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The index of refraction is a measure of the speed of light in a material.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Transmission
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This is the amount of light transmitted through a material.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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