Instrumentation Amplifier Chips Specifications

Package Characteristics


	Package Type
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	DIP		Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
	CDIP		Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	PDIP		Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications.
	DPAK		DPAK refers to a type of transistor outline package (T0-252).
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	SIP		SIP refers to a single inline package.
	SOIC		SOIC refers to a small outline IC.
	SSOP		SSOP refers to a shrink small outline package.
	SOP		SOP is a small outline package.
	MSOP		Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping.
	SOT		SOT packaging refers to a small outline transistor.
	SOT23		SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
	PSOP		PSOP refers to a power small outline package.
	QFP		QFP is a quad flat package.
	TO-220		Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220.
	TO-3		Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3.
	SC-70		SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited.
	TSSOP		TSSOP refers to thin shrink small outline L-leaded packages.
	QSOP		QSOP refers to a quarter size outline package.
	PLCC		PLCC refers to a plastic leaded carrier.
	UCSP		UCSP refers to an ultra chip scale package.
	Other		This refers to other unlisted, specialized, or proprietary packages.
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Features


	On-Chip ESD Protection		The chip has embedded radiation protection.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Rail-to-Rail Output		The rail-to-rail output voltage swing is measured from the negative to the positive value of the supply voltage.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Rail-to-Rail Input		The rail-to-rail input voltage can vary from the negative to the positive value of the supply voltage.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Single Supply		The chip can operate with only one supply.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Thermal Shutdown Protection		The regulator has an embedded control circuit that shuts down the device when the temperature exceeds a predefined limit.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

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