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Package Type
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Your choices are...
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DIP
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Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP).
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CDIP
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Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
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PDIP
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Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications.
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DPAK
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DPAK refers to a type of transistor outline package (T0-252).
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CSP
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Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
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SIP
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SIP refers to a single inline package.
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SOIC
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SOIC refers to a small outline IC.
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SSOP
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SSOP refers to a shrink small outline package.
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SOP
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SOP is a small outline package.
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MSOP
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Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping.
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SOT
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SOT packaging refers to a small outline transistor.
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SOT23
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SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
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PSOP
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PSOP refers to a power small outline package.
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QFP
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QFP is a quad flat package.
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TO-220
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Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220.
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TO-3
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Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3.
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SC-70
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SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited.
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TSSOP
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TSSOP refers to thin shrink small outline L-leaded packages.
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QSOP
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QSOP refers to a quarter size outline package.
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PLCC
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PLCC refers to a plastic leaded carrier.
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UCSP
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UCSP refers to an ultra chip scale package.
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Other
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This refers to other unlisted, specialized, or proprietary packages.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Pin Count
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Pin count is the number of physical connection points (e.g., pins, pads, balls) on the package.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Number of Devices in Package
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This refers to the number of devices in the package.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Hz).