Digital Decoders and Demultiplexers Specifications

IC Chip Specifications


	Package Type:
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	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	PBGA		Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm.
	TBGA		Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts.
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	LQFP		Low quad flat package (LQFP).
	TQFP		Thin quad flat package (TQFP).
	SOP		Small outline package (SOP).
	SOIC		Small outline integrated circuit (SOIC).
	TSOP Type I, II		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	SSOP		Shrink small outline package (SSOP).
	TVSOP		Thin very small outline package (TVSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	HSOF		Small outline flat-leaded package with heat sink (HSOF).
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
	PDIP		Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
	CDIP		Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	SIP		Single in-line package (SIP).
	SDIP		Shrink dual in-line package (SDIP).
	SZIP		Shrink zigzag in-line package (SZIP).
	Other		Other unlisted, specialized, or proprietary IC packages.
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	Logic Family
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	Transistor-Transistor Logic (TTL)		Transistor-transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT), diodes and resistors. It is notable, as it was the base for the first widespread semiconductor integrated circuit (IC) technology. All TTL circuits operate with a 5 V power supply. TTL signals are defined as "low" or L when between 0 V and 0.8 V with respect to the ground terminal, and "high" or H when between 2 V and 5 V. The first logic devices designed from bipolar transistors were referred to as standard TTL. The addition of Schottky diodes to the base collector of bipolar transistor was called Schottky logic (S-TTL). Schottky diodes shorten propagation delays within TTL by preventing the collector from going into what is called “deep saturation.” Other TTL technologies include low-power Schottky (LS-TTL), advanced Schottky (AS-TTL), advanced low-power Schottky (ALS-TTL), and low-voltage TTL (LVTTL).
	FAST		Fairchild advanced Schottky TTL (FAST) technology was created in late 1970 when advances in IC technology allowed the speed and drive of S-TTL to be combined with the lower power of LS-TTL to form a new logic. An advanced related family is the FASTr, which is faster then FAST, has a higher driving capability (I_OL, I_OH), and produces much lower noise. The “r” in FASTr refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed.
	Standard CMOS / CMOS (4000)		Complementary metal-oxide semiconductor (CMOS) logic uses a combination of p-type and n-type metal-oxide-semiconductor field effect transistors (MOSFET) to implement logic gates and other digital circuits found in computers, telecommunications and signal processing equipment. It is the technology of choice for many present-day digital integrated circuits. CMOS 4000 refers to the series 4000 that is true CMOS with non-TTL levels.
	Fast CMOS		Fast CMOS technology (FCT) was introduced in 1986. With this technology the speed gap between CMOS and TTL was closed. Since FCT is the CMOS version of FAST, it has the low power consumption of CMOS but speed comparable with TTL. Advanced versions of the FCT standard are FCTx and FCTx-T. The x in FCTx and FCTx-T refers to the various speed grades, such as A, B and C, where an “A” designation means low speed and “C” means high speed.
	High-Speed CMOS		High-speed CMOS technology (HCMOS) is also known as HC / HCT. There are several basic flavors of HCMOS technology: high-speed CMOS (HC), high-speed CMOS with TTL input (HCT), advanced high-speed CMOS (AHC), and advanced high-speed CMOS with TTL inputs (AHCT).
	Advanced CMOS		Advanced CMOS is a much higher speed version of HCMOS. It is also known as AC / ACT. Advanced CMOS technology comes in different flavors: standard advanced CMOS (AC), advanced CMOS with TTL inputs (ACT), advanced CMOS with quiet outputs (ACQ), advanced CMOS with TTL inputs and quiet outputs (ACTQ), advanced ultra-Low voltage CMOS (AUC), advanced ultra-low power CMOS (AUP), advanced very-low voltage CMOS (AVC), advanced low voltage HCMOS (ALVC), and advanced low voltage CMOS with bus hold (ALVCH). ACQ / ACTQ are second generation Advanced CMOS with much lower noise. While ACQ has the CMOS input level, ACQT is equipped with TTL level input.
	Low Voltage CMOS		There are several low voltage CMOS technologies: standard low voltage (LV), low voltage high performance HCMOS (LVC), low voltage CMOS technology with TTL inputs (LVT), Low voltage with TTL inputs and high impedance (LVTC), advanced low voltage CMOS with bus hold (ALVCH), low voltage CMOS that operates with 3 V or 5 V (LCX), and low voltage CMOS that operates with 1.8 V or 3.6 V (VCX).
	BiCMOS		BiCMOS is a SiGe Bipolar technology that combines the high speed of bipolar TTL with the low power consumption of CMOS. There are a number of BiCMOS flavors including advanced BiCMOS technology (ABT), advanced BiCMOS technology with enhanced transceiver logic (ABTE), advanced low-voltage BiCMOS (ALB), advanced low-voltage BiCMOS technology (ALVT), BiCMOS with TTL inputs (BCT), BiCMOS with backplane and transceiver logic (BTL), and low-voltage BiCMOS technology (LVT).
	Emitter Coupled Logic (ECL)		Emitter coupled logic (ECL) uses transistors to steer current through gates that compute logical functions. By comparison, TTL and related families use transistors as digital switches, where the transistors are either cut off or saturated, depending on the state of the circuit. This distinction explains ECL's chief advantage: that because the transistors are always in the active region, they can change state very rapidly, so ECL circuits can operate at very high speed; and also its major disadvantage: the transistors are continually drawing current, which means the circuits require high power, and thus generate large amounts of waste heat. ECL gates use differential amplifier configurations at the input stage. A bias configuration supplies a constant voltage at the midrange of the low and high logic levels to the differential amplifier, so that the appropriate logical function of the input voltages will control the amplifier and the base of the output transistor. The propagation time for this arrangement can be less than a nanosecond. Other noteworthy characteristics of the ECL family include the fact that the large current requirement is approximately constant, and does not depend significantly on the state of the circuit. This means that ECL circuits generate relatively little power noise, unlike many other logic types that typically draw far more current when switching than quiescent, for which power noise can become problematic. ECL circuits operate with negative power supplies, and logic levels incompatible with other families, which means that interoperation between ECL and other designs are difficult. The fact that the high and low logic levels are relatively close mean that ECL suffers from small noise margins, which can be troublesome in some circumstances.
	Integrated Injection Logic (I²L)		Integrated injection logic (I2L) is based on bipolar transistor logic. It is commonly referred to as "I-square-L."
	Silicon on Sapphire (SOS)		Silicon on sapphire (SOS) is a hetero-epitaxial process wherein a thin layer of silicon is “grown” on a sapphire (Al₂O₃) wafer. SOS is part of the silicon on insulator (SOI) family of CMOS technologies. SOS is primarily used in military and space applications because of its inherent resistance to radiation. It has seen little commercial use to date because of difficulties in fabricating the very small transistors used in modern high-density applications. Problematically, the SOS process often results in the formation of dislocations from crystal lattice disparities between the sapphire and silicon. This leads to unusable wafers and drives up the production cost.
	Gallium Arsenide (GaAs)		Gallium arsenide (GaAs) is a compound semiconductor mixing the strength of two elements, gallium (Ga) and arsenic (As). Gallium is a byproduct of the smelting of other metals, notably aluminum and zinc, and is rarer than gold. Arsenic is not rare, but it is poisonous. Gallium arsenide has many uses including being used in some diodes, field-effect transistors (FETs), and integrated circuits (ICs). GaAs components are useful at ultra-high radio frequencies and in fast electronic switching applications. GaAs devices generate less noise than most other types of semiconductor components and, as a result, are useful in weak-signal amplification applications. Gallium arsenide is used in the manufacture of light-emitting diodes (LEDs), which are found in optical communications and control systems. Gallium arsenide can replace silicon in the manufacture of linear and digital ICs. Digital devices are used for electronic switching, and also in computer systems.
	Crossbar Technology (CBT)		Crossbar technology (CBT) enables a bus interface to function as a very fast bus switch, isolating the bus when the switch is open and offering very little delay when the switch is closed. Opening the switch provides circuit isolation (high impedance). Closing the switch provides a near-zero propagation delay through a 5-Ohm resistance. Bus switch technology is used in programmable logic devices (PLDs) for improved performance. Typically, CBT devices operate from 4.5 V to 5.0 V. CBT is also known as quick switch (QS), fast switch technology (FST), or Pericom Interface (PI5C).
	Gunning Transceiver Logic (GTL)		Gunning transceiver logic (GTL) is a standard for electrical signals in CMOS circuits that is used to provide high data transfer speeds with small voltage swings.
	Other		Other unlisted logic families.
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	Pin Count		The number of pins in the package.
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	Number of Units in the Chip:		Total number of devices in the package.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

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