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IC Package Type
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Your choices are...
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DIP / CDIP / PDIP
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Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
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DPAK
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Discrete package or deca-watt (DPAK).
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D2PAK
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D2PAK is large surface mounted package that include a heat sink.
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IPAK
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Integrated package (IPAK).
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I2PAK
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I2PAK is a plastic package with three leads.
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PPAK
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Power packaging (PPAK).
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MELF
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Metal electrode leadless face (MELF) component diodes have metallized terminals at each end of a cylindrical body. MELF components are designed to fit the same footprints as flat components. MELF packages are available on plastic tape and reel.
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DO-15
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DO-15 is a diode outline (DO) package.
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DO-35
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DO-35 is a diode outline (DO) package.
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SOD
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Small outline diode (SOD) package.
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SOT3
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SOT3 is a small outline transistor (SOT) package.
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SOT223
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SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink.
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TO-3
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TO-3 is a transistor outline (TO) package with three leads.
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TO-3P
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TO-3P is a transistor outline (TO) package with three leads.
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TO-39
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TO-39 is a transistor outline (TO) package.
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TO-92
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TO-92 is a transistor outline (TO) package.
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TO-202
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TO-202 is a transistor outline (TO) package.
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TO-220
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TO-220 is a transistor outline (TO) package.
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TSOP
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Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
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TSSOP
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Thin shrink small outline L-leaded package (TSSOP).
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TSOJ
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Thin small outline J-leaded package (TSOJ).
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Other
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Other unlisted, specialized or proprietary packages.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Pin Count
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The number of physical connection points (e.g., pins, pads, balls) on the package.
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Number of Thyristors in Package
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The number of diodes embedded in the chip (package).
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Search Logic:
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User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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