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IC Package Type
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Your choices are...
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DIP / CDIP / PDIP
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Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
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DPAK (TO-252)
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Discrete package or deca-watt (DPAK).
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PPAK (QFN-16)
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Power packaging (PPAK).
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QFP
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Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
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SC-70
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SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited.
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SO-8
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Small outline (SO) package with 8 pins.
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SO-14
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Small outline (SO) package with 14 pins.
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SO-20
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Small outline (SO) package with 20 pins.
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SSOP
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Shrink small outline package (SSOP).
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SOIC / SOP
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Small outline integrated circuit (SOIC). Small outline package (SOP).
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SOJ
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Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
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SOT23
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SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
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SOT89
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SOT89 is a plastic, surface mounted, small outline transistor (SOT) package with three leads and a collector pad for good heat transfer. Unlike other packages, SOT89 lead posts are up-set and not down-set. SOT89 is designed for medium power and high-speed switching applications. It is also used in applications that feature very low RDS (on), no secondary breakdown, and direct interface to complementary metal oxide semiconductor (CMOS) and transistor-transistor logic (TTL).
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TO-3
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TO-3 is a transistor outline (TO) package with three leads.
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TO-39
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TO-39 is a transistor outline (TO) package.
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TO-92
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TO-92 is a single in-line, transistor outline (TO) package that is often used for low power devices. One of the oldest power packages, TO-92 is suitable for applications in office and communication equipment.
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TO-220
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TO-220 is a transistor outline (TO) package that is suitable for high power, medium current, and fast-switching power devices. TO-220 is used in home appliances, office and industrial equipment, and personal and consumer electronics. A package variant, TO-220 Full Pack, includes a fully encapsulated heat sink that does not require extra hardware for electrical isolation. TO-220 Full Pack has the same footprint as TO-220, provides electrical isolation up to 5 KV, and is often used in motor drive applications and power supplies.
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TO-263
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TO-263 is the surface-mount version of the TO-220 package. TO-263 is a transistor outline (TO) package with 2, 3, 5, 6, or 7 leads. TO-263 can accommodate large dice because of its large pad design. It is suitable for high power applications due to its low resistance. Typical applications for TO-263 include home appliances and personal computers.
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Other
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Other unlisted, specialized, or proprietary IC package types.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Life Cycle Stage
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This is the current product lifecycle stage, as defined by EIA-724.
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Your choices are...
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Introduction
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Product planning or design is underway. Samples may or may not exist. Specification changes may occur and planned introduction dates may be delayed. Orders and product shipments are not permitted. This stage is not part of the EIA-724 product life cycle data model.
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New Product
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Production is beginning to ramp up. Limited quantities are available. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model.
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Rapid Growth
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Production is increasing rapidly. Manufacturing capacity is being added. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model.
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Maturity
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Product growth has stabilized or peaked. Product quality is very high. Orders and shipments are permitted. Product is recommended for use in new designs. This stage is part of the EIA-724 product life cycle data model.
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Saturation
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Sales and capacity have peaked. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model.
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Not Recommended (Declining)
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Capacity is beginning to decline. Orders and shipments are permitted, but devices are not recommended for new designs. This stage is part of the EIA-724 product life cycle data model.
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Phase Out
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Capacity is declining rapidly. A formal discontinuance notice may be issued. Limitations on shipments can occur, but orders are still allowed. Devices are not considered for new designs. This stage is part of the EIA-724 product life cycle data model.
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Last Shipments
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Final shipments are made for existing orders. New orders are limited to existing or residual inventories. Manufacturing capacity limitations may exist. This stage is not part of the EIA-724 product life cycle data model.
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Removed
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Devices are unavailable. Product inventories and all supporting hardware, software, and documentation have been removed. New orders and new shipments are not permitted. This stage is not part of the EIA-724 product life cycle data model.
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Other
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Other unlisted life cycle stages.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Special Features
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Your choices are...
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Shutdown (Inhibit) Pin
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Shutdown (inhibit) pins are used to disable the regulator outputs.
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Reverse Voltage Protection
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This feature prevents damage to the regulator when the input voltage is reversed. It is essential in applications where a user can accidentally reverse the polarity of the batteries, or make similar mistakes.
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Error Flag
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This flag is used to alert monitoring or control circuitry that the output has dropped (generally 5%) below its nominal value.
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Internal Current Limit
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Regulators have an internal circuit to control the amount of current produced.
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Input Overcurrent Protection
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Regulators have an internal circuit that protects it when an excessive input current is applied.
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Thermal Shutdown Protection
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Regulators have an embedded control circuit that shuts down the device when the temperature exceeds a predefined limit.
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Multiple Outputs
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Regulators have more than one output (channel).
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Other
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Other unlisted features.
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Search Logic:
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All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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