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Application specific integrated circuits (ASIC) are electronic chips designed for a particular application.
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Capacitors are electronic components used for storing charge and energy. In their simplest form, capacitors consist of two conducting plates separated by an insulating material called the dielectric.
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Chip capacitors or surface mount capacitors do not have leads.
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Chip inductors are manufactured using semiconductor material.
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Chip resistors are passive resistors with a form factor of an integrated circuit (IC) chip. Typically, they are manufactured using thin-film technology.
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Chipsets are single chips that provide many of the functions of a motherboard. Generally, they integrate the clock generator, bus controllers, system timer, interrupt controller, DMA controller, CMOS/RAM clock, and keyboard controller functions.
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Diodes are electronic components that conduct electric current in only one direction, functioning as a one-way valve. Diodes are manufactured using semiconductor materials such as silicon, germanium or selenium and are used as voltage regulators, signal rectifiers, oscillators and signal modulators / demodulators.
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Dynamic random access memory (DRAM) chips are single-transistor memory cells that use small capacitors to store each bit of memory in an addressable format that consists of rows and columns. Because capacitors are unable to hold a charge indefinitely, DRAM memory chips require a near-constant pulse of current to retain stored information.
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DRAM modules are collections of dynamic random access memory (DRAM) chips assembled on circuit boards.
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Electrically erasable programmable read-only memory (EEPROM) chips are similar to PROM devices, but require only electricity to be erased.
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Erasable programmable read-only memory (EPROM) chips are programmable, reusable computer chips that can be erased using ultraviolet light and reprogrammed with a PROM programmer or PROM burner.
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Field-programmable gate arrays (FPGAs) have a different architecture than SPLDs and CPLDs, and typically offer higher capacities. FPGAs are also known as logic cell arrays (LCA) and programmable ASIC (pASIC).
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First-in, first-out (FIFO) memory chips are used in buffering applications between devices that operate at different speeds, or in applications where data must be stored temporarily for further processing.
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FLASH memory chips offer extremely fast access times, low power consumption, and relative immunity to severe shock or vibration. They do not need a constant power supply to retain their data.
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IC interfaces are semiconductor chips that are used to control and manage the sharing of information between devices.
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Inductors coils and chokes are passive components that are designed to resist changes in current and store energy in the form of a magnetic field.
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Memory chips are internal storage areas in computers. Although the term “memory chip” commonly refers to a computer's random access memory (RAM), this product area includes many different types of electronic data storage. Computer memory stores data electronically in cells. Without memory chips, a computer could not read programs or retain data.
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Programmable logic devices (PLD) are designed with configurable logic and flip-flops linked together with programmable interconnect. PLDs provide specific functions, including device-to-device interfacing, data communication, signal processing, data display, timing and control operations, and almost every other function a system must perform.
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Resistor, capacitor networks (RC networks) are integrated circuits (ICs) that contain resistor-capacitor arrays in a single chip.
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Resistors and potentiometers are passive electronic components that oppose the flow of either alternating current (AC) or direct current (DC).
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Simple programmable logic device (SPLD) chips are the simplest, smallest and least expensive type of programmable logic device (PLD). They typically comprise 4 to 22 fully connected macro cells.
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SRAM chips use static random access memory (SRAM), a type of memory that is faster, more reliable, and more expensive than DRAM. Unlike DRAM, SRAM does not need to be refreshed in order to prevent data loss; however, SRAM requires more power than DRAM.
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SRAM modules are collections of static random access memory (SRAM) chips assembled on circuit boards.
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System on a chip (SoC) devices are semiconductor chips with embedded components that make the chip a standalone system.
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