Advanced Techniques US, Inc. - Manufacturer of BGA/CSP Placement Rework Stations, Fine Pitch Pick Place Systems, and Convection Reflow Ovens. BGA Rework services available.
Stand-alone system for removal and installation of components up to 2.25" x 2.25" on PCB's up to 20" x 20". Features the latest vision and process control technologies.
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Industrial ovens are batch or continuous process enclosures or tunnels that are insulated and used for thermal processing. Ovens are lower temperature (usually < 1400° F) thermal processing units, usually without refractory insulation.
Surface mount technology (SMT) manufacturing equipment is used to populate printed circuit boards (PCB). This includes soldering machines, ovens, component placement, paste depositors and screen and stencils.
Soldering irons, stations and accessories bond two or more metallic surfaces together with a low melting alloy solder such as tin/lead or Sn/Cu/Ni/Ge alloys, which is melted, wets the surface and resolidifies forming a soldered joint.