Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Glass materials have a random, liquid like (non-crystalline) molecular structure. They are heated to a temperature sufficient to produce a completely fused melt.
Thermoset adhesives are crosslinked polymeric resins that are cured using heat and/or heat and pressure. They are used for high load assemblies and in severe service conditions.
