S-Bond Technologies LLC - Product Announcements

Active solder joining of silicon and other semiconductors to metals, ceramics and composites for sensors, electronic packages and PV (solar) cells and modules. (read more)

S-Bond Technologies' Active Solder alloys are modifications of conventional solder alloys that wet and bond without the use of flux. All are lead and cadmium free. They are uniquely suited for bonding a wide range of materials, such as Al-Al, titanium-sapphire, glass & ceramic to metal, etc. Reliable hermetic bonding at temperatures lower than brazing. (read more)

S-Bond® active solders are a versatile bonding agent that makes the production of sputter targets easier, less costly while offering higher bond performance for most sputter target and backing plate materials. (read more)

Bonding sensors and sensor housings. Uniquely joining a wide range of metals and ceramics. (read more)