Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product

Specialty materials includes specialty or proprietary materials that are not part of other areas

Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation or resilience

Polymer and plastic composites are strengthened with fibers, fillers, particulates, powders and other matrix reinforcements to provide improved strength and/or stiffness.

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications

Plastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes.

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils.