Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils.

Specialty cement, concrete and mortar contain specialized binders such as K silicate, calcium aluminate, sulfur, and oxysulfate or polymer resins.

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Industrial furnaces are built of several kinds of high temperature (refractory) materials to hold the process material and hold in the heat without breaking down during the several months that they usually run.

Vacuum furnaces are heat-treating furnaces that use a low atmospheric pressure instead of a protective gas atmosphere.

Laboratory furnaces provide continuous heating to process samples and materials.

Powder compacting equipment is used to shape powders as part of a forming process and to compress a wide range of materials into compact shapes for ease of transportation and handling.