Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils.

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications

Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.

Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components.

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables.

Elastomers and rubber materials are characterized by their high degree of flexibility and elasticity (high reversible elongation or resilience).

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.