Packaging tapes and films are used to seal or wrap boxes, bottles or other packages

Contract packaging services package and/or label products and materials produced by other companies on a contract basis

Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices

Metal-oxide semiconductor field-effect transistors (MOSFETs) are electronic devices with a built-in capacitor as the input and a conducting channel as the output.

Rotary coded dual in-line package (DIP) switches are activated by a rotating shaft and have several stop positions.

Dual in-line package (DIP) switches are electronic packages that consist of a series of tiny switches.

Current sense transformers are used to detect and measure current.