Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils.

Molding compounds and resins are industrial plastics and polymers that are suitable for forming.

Polymer and plastic composites are strengthened with fibers, fillers, particulates, powders and other matrix reinforcements to provide improved strength and/or stiffness.

Resins and compounds are pellets, liquid resins, bulk molding compounds, or other unfinished materials that are ready for shape fabrication or bond formation

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications

Conductive adhesives and compounds provide an electrically and/or thermally conductive path between components

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product