Foam bonding tapes are specialized tapes designed for adhesive joining of foam materials

Ground bond testers are electrical safety test devices that perform electrical compliance tests

Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices.

Ground resistance testers are devices that are used to measure and test electrical grounding systems.

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils.

Double coated tapes are coated with adhesive on both sides of the backing or carrier.

Specialty tapes and films use proprietary or patented technologies and constructions, and are designed for specific industries and specialized applications.