Intellectual property (IP) cores are pre-designed, pre-tested, integrated circuits or boards of industry-standard functions that can be easily used in embedded applications.

Foam, honeycomb and core materials are plastics, ceramics or metals containing closed or open internal cells or pores for composites, tooling, modeling, insulation or floatation

Core modules are computer boards or integrated circuits that are populated with electronic components and used in embedded applications.

Panels and panel materials are composite structures which consist of multiple layers or skins often bonded to or sandwiching a core material such as multilayer sheets, cored laminates or industrial structural panels

Ferrite ceramics and ferromagnetic materials have dielectric and magnetic properties that are suitable for RF and microwave applications.

Ferrite beads are used to suppress unwanted signals that can interfere with electrical devices such as DC supplies, transmission lines and cables.

Foams and foam materials are industrial products made from low density elastomers, plastics, and other materials with various structures and porosities.