Intellectual property (IP) cores are pre-designed, pre-tested, integrated circuits or boards of industry-standard functions that can be easily used in embedded applications.

NEMA and IP enclosures are used to house and protect electrical devices and electronic components.

VoIP and IP telephony allows PC users to make phone calls over the Internet or other packet networks via gateways and standard telephones

Foam, honeycomb and core materials are plastics, ceramics or metals containing closed or open internal cells or pores for composites, tooling, modeling, insulation or floatation

IndustryPack^® modules are computer boards that interface with the IndustryPack (IP) mezzanine bus, a device used to provide input/output (I/O) capabilities in general-purpose computer systems.

Core modules are computer boards or integrated circuits that are populated with electronic components and used in embedded applications.

Panels and panel materials are composite structures which consist of multiple layers or skins often bonded to or sandwiching a core material such as multilayer sheets, cored laminates or industrial structural panels