Gaskets are used to prevent fluid or gas leaks by providing a barrier between two mating surfaces

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.

Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.

Electrical insulation and dielectric materials surround and protect electrical conductors such as wires and cables.

EMI and RFI shielding includes coatings, gaskets, enclosures, sealants, resins and other products or materials that block out electromagnetic interference (EMI) and radio frequency (RF) interference

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils.

Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material.