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Product Alerts
Keep current on the latest products, new suppliers, and technical articles of interest to you. (See Topics) |
Products/Services for potting compound
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. Search by Specification | Learn More
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications. Search by Specification | Learn More
Industrial sealants are liquid or viscous compounds used between surfaces to contain fluids, prevent leaks, and prevent infiltration of unwanted material. Search by Specification | Learn More
Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications. Search by Specification | Learn More
Specialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions. Search by Specification | Learn More
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PTS-56227 Protavic America, Inc.
Encaptrax™ 121 and 121-B Glotrax Polymers Inc. |
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Thermally Conductive Potting Compound | Machine Design THERMALLY CONDUCTIVE POTTING COMPOUND The black, aluminum oxidefilled compound can also serve as a structural adhesive in heat-sink lap joints. |
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Electronic potting compound | Machine Design Electronic potting compound December 8, 2005 |
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UV-Cure Adhesive/Potting Compound | Machine Design UV-Cure Adhesive/Potting Compound May 10, 2007 |
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Product Spotlight: Flexible, Low-Viscosity Potting Compound |... Product Spotlight: Flexible, Low-Viscosity Potting Compound |
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Machine Design | UV-Cure Adhesive/Potting Compound The electronic-grade UV Cure 60-7108 is a low |
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Machine Design | Product Spotlight: Flexible, Low-Viscosity Potting Compound |
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Machine Design | Electronic potting compound Electronic-grade epoxy potting and encapsulating compound 20-3063 has a dielectric strength of 450 V/mil. |
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Feed for Fastening & Joining Terms | Machine Design Product Spotlight: Flexible, Low-Viscosity Potting Compound |
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Articles By Author | Machine Design Electronic potting compound Electronic-grade epoxy potting and encapsulating compound 20-3063 has a dielectric strength of 450 V/mil. |
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More articles by MD Staff | Machine Design Electronic potting compound Electronic-grade epoxy potting and encapsulating compound 20-3063 has a dielectric strength of 450 V/mil. |