Burn-in test equipment uses elevated voltages, temperatures and power cycling to evaluate high power chips, boards or products. The burn-in process tests the quality of the semiconductor device before it is incorporated into a finished device, ensuring that an IC chip with a latent defect is weeded out. Burn-in test equipment accelerates any potential failures in substandard products, known in the semiconductor industry as the "infant mortality" of a device. Devices that survive a burn-in period are usually free of early failures and other operational problems.