Thin film circuits and thin film products are metallized or plated onto ceramic or glass substrates. They are fabricated via thin film deposition techniques such as chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation, plasma etching or cleaning, rapid thermal processing (RTP), and vacuum annealing. In specialty electronics manufacturing, thin film deposition is used to create layers of insulators, semiconductors, and conductors to form integrated circuits (IC). For example, a thin film transistor (TFT) is a field effect transistor (FET) made by depositing the metallic contacts, semiconductor active layer, and dielectric layer as thin films. With thin film circuits and thin film products, the metallization layer is made of a conducting material that is selectively deposited or etched to form connections between logic gates. The dielectric layers act as insulating stand-offs between the conducting layers.