About Electronic and IC Packaging Services
Electronic packaging and IC packaging services manufacture integrated circuits (ICs) for industrial and commercial applications. Integrated circuit packaging, the final stage of semiconductor device fabrication, places bare dies or bare boards inside of a protective package that provides connectors or pins for connecting to other devices. Protective IC packaging is produced via integrated circuit encapsulation, the last stage of the semiconductor device fabrication process. Today, electronic packaging and IC packaging services provide many different types of IC packages. Examples include single in-line package or system in package (SIP), dual in-line package, (DIP), mini small-outline package (MSOP), micro leadframe package (MLP), shrink small outline package (SSOP), thin shrink small outline package (TSSOP), and very small outline package (VSOP). Electronic component packaging includes tinning, tape and reel packaging, lead forming, baking, lead straightening, and programming.
Engineering Web: Electronic and IC Packaging Services - Machine Design
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The Machine Design Tech Insider Recently it compared the environmental burdens of consumer packaging made from common plastics such as PET and polypropylene (PP) to those associated |
