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About Encapsulants and Potting Compounds
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics. Encapsulants and potting compounds belong to a broader category of electrical resins and electronic compounds that includes adhesives, greases, gels, pads, stock shapes, gaskets, tapes, and thermal interface materials. Most potting compounds are based on polymeric resins or adhesives; however, materials based on ceramic or inorganic cements are often used in high temperature applications. Some encapsulants and potting compounds are designed to form a thermally conductive layer between components or within a finished product. These thermally conductive products are used between a heat-generating electrical device and a heat sink to improve heat dissipation.


Products & Services Related to Encapsulants and Potting Compounds
Anaerobic Adhesives and Anaerobic Sealants
Anaerobic adhesives and sealants cure in the absence of air or oxygen.
Electrical Resins and Electronic Compounds
Electrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Hot Melt Adhesives
Hot melt adhesives are solvent-free chemical compounds that are used to join materials. They can be repeatedly softened by heat and hardened or set by cooling, allowing parts to be removed or repositioned during assembly.
Plastic and Rubber Balls
Plastic and rubber balls are sphere shapes that are used as check or ball valves, bearings, and in other applications.
Plastics and Plastic Materials
Plastics and plastic materials are organic, synthetic or processed polymers that are supplied as raw materials or stock shapes. They typically consist of thermoplastic or thermosetting resins and can be made into many forms.
Rubber Adhesives and Sealants
Rubber adhesives and rubber sealants are highly flexible, natural or synthetic materials that are used to join components or fill gaps between seams or on surfaces.
Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
See more product announcements for Encapsulants  and Potting Compounds
Clear Potting and Encapsulating Compound

Clear Potting and Encapsulating Compound
Epoxies Etc...


DYMAX 9001-E-v3.1 Chip Encapsulant

DYMAX 9001-E-v3.1 Chip Encapsulant
DYMAX Corporation



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Potting



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