Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics. Encapsulants and potting compounds belong to a broader category of electrical resins and electronic compounds that includes adhesives, greases, gels, pads, stock shapes, gaskets, tapes, and thermal interface materials. Most potting compounds are based on polymeric resins or adhesives; however, materials based on ceramic or inorganic cements are often used in high temperature applications. Some encapsulants and potting compounds are designed to form a thermally conductive layer between components or within a finished product. These thermally conductive products are used between a heat-generating electrical device and a heat sink to improve heat dissipation.

